CMP Solutions

Smoothing the Path to Semiconductor Innovation

Advanced CMP slurries, micro-nano abrasive powders, and AI-driven process optimisation for next-generation wafer surfaces.

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AI & Machine Learning

Machine Learning Optimised CMP Processing

8 ML models benchmarked. 50+ experiments. From trial-and-error to data-driven precision �?achieving Ra < 0.08 nm surface finishes.

SiC Wafer Solutions

Solving SiC Substrate Challenges

Creating defect-free silicon carbide wafer surfaces with industry-leading polishing rates and sub-0.2nm roughness.

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Featured Products

CMP slurries and micro-nano abrasive powders engineered for the most demanding wafer manufacturing processes.

SiC Wafer CMP Slurries

High-performance silicon carbide slurries for low-defectivity substrates. Si-face, C-face, and poly-SiC optimised.

Ra < 0.2 nmNo SSDHVM Ready

GaN / Nitride CMP Slurries

Innovative solutions for GaN, AlGaN, AlN �?Ga- or N-face polishing with ultra-high removal rates.

Ultra-high MRRRa < 0.2 nmZero SSD

AI Process Optimisation

Machine learning models trained on 50+ experiments to find optimal CMP parameters in days, not months.

8 ML ModelsR² = 0.95Bayesian Opt.

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Trusted PartnersVishayiQEMicrochipCardiff UniversityCSconnected

We develop the purest products

Helping you achieve zero defects and maximum operational efficiency in semiconductor manufacturing.